Abstract
Low-power application devices and inexpensive transistors are essential for
today's technological world. A 3 nm MOSFET nanoelectronic device has just been
created by researchers. Even though a MOSFET shrinks in size and uses less power,
SCEs still cause a few problems, leakage current, including Hot electron, Impact
Ionization, threshold voltage roll-off, Drain Induced Barrier Lowering (DIBL), and
others. One of the best-proposed structures to replace the MOSFET structure is the FIN
FET structure, which overcomes the limitations brought on by the CMOS transistor.
For low-power applications, the FIN FET structure is ideal. A FINFET structure
achieves an average subthreshold swing of 60 mv/decade at room temperature beyond
the boundaries of CMOS. This paper examines the performance of the many FINFET
architectures that have been proposed, including the double gate, tri-gate, and Gate All
Around FET.