Abstract

The microchannel heat sink is proposed with the advantages of small volume, light weight, low noise, easy integration and high heat transfer coefficient, which can meet the cooling demand for the power density greater than 100 . The latest research status of micro-channel heat sinks is summarized in this paper, and the typical design structures are analyzed. In this paper, various patents have been discussed, and an overview of its application fields and the main problems are showed. The prospect and development trends are also described in this paper.

Keywords: 3D IC, heat sinks, LTCC, micro-channel, power density, temperature gradient.