Recent Patents on Mechanical Engineering

Author(s): Yanqin Zhang, Wanli Lu*, Mulan Wang and Yefeng Qian

DOI: 10.2174/2212797616666230127122637

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Analysis of Temperature Field of Silicone Heating Plate based on COMSOL

Page: [2 - 10] Pages: 9

  • * (Excluding Mailing and Handling)

Abstract

Background: In the manufacturing process of lithium batteries for new energy vehicles, silica gel plates shall be used as heating and thermal insulation. This paper takes four groups of silica gel heating plates with different specifications as the research object to predict the temperature distribution of silica gel plates and provide theoretical references for the manufacturing engineering of silica gel heating plates.

Objective: Combined with the heat transfer theory, the temperature distribution of silica gel heating plate is predicted by simulation calculation, and the feasibility of this method is verified by experiments, which provide references for the manufacturing engineering of silica gel heating plate.

Methods: This article takes four groups of silica gel plates with different specifications as the research objects, and 30 temperature measurement points are collected. The simulation results are compared with the experimental results to verify the method’s feasibility.

Results: The average error between the experimental and simulation results was ± 2.6°C, which was in line with the expected effect of silica gel plates. This paper’s research process and method can provide theoretical references for the manufacturing engineering of silica gel heating plates.

Conclusion: Taking the silica gel heating plate provided by the factory as the research object, according to the heat transfer theory, the thermal conductivity equation of the silica gel plate was established, which provided a theoretical model for simulation analysis. The experimental results show that the average error between the simulation and experimental results is ±2.6°C, which is in line with the empirical expectation, and the method is feasible. This paper’s research process and practice can provide theoretical reference for the manufacturing engineering of silica gel heating plate.

Keywords: Silicone, heating plate, COMSOL, electrothermal coupling, temperature field, silica gel.